| 摘要 |
PURPOSE:To enable detecting of only a fatal notch of chip notches at a die bonding time, by forming a detecting window according to types of chips to be inspected. CONSTITUTION:A pattern of a semiconductor chip 42 is binary-coded and stored (12) by a pre-processing circuit 6. Meanwhile, a chip image signal from a TV camera 1 is applied to an instructor 9 to instruct a shape of a detecting window. From the content of the memory 12, the position of the chip is detected by a detecting circuit 15. From the position information of the chip and the relative position information of a detecting window for a content of a detecting window position memory 32, a notch detecting window position computing circuit 22 finds a detecting window information to apply it to a notch detecting circuit 18. From the detecting window position information and the binary-coded image of the content of the memory 12, the circuit 18 detects a fatal notch to supply it to a display unit 38. |
