| 摘要 |
PURPOSE:To make coating liquid uniform the surface of a semiconductor wafer by a method wherein fins are installed in a part of spinning section which supports the wafer to flow the atmosphere around the wafer downward from the coating side when liquid is spincoated on the wafer. CONSTITUTION:A cup 2, which has a hole to pass through a spinning axis in the center of the bottom and a hole to drain extra coating liquid, is placed in a vessel 1. A wafer chuck 7 that is provided in the cup 2 to mount a semiconducter wafer 8 is spinned by a spinning shaft 4 having bearings 5, 6 and by a hollow shaft motor 3. In addition, the chuck 7 has many fins 10 on its side so that coating liquid 9, scattered in dropping coating liqud on the wafer 8 and extended by spinning, is conveyed toward the outlet with the air flow generated by the fins 10. With such a mechanism, coating liquid 9 will not return to the wafer 8 again, which avoids its abnormal spreading. |
