发明名称 METHOD OF FORMING CONDUCTIVE CIRCUIT
摘要 PCT No. PCT/JP85/00327 Sec. 371 Date Feb. 10, 1986 Sec. 102(e) Date Feb. 10, 1986 PCT Filed Jun. 12, 1985 PCT Pub. No. WO86/00190 PCT Pub. Date Jan. 3, 1986.Disclosed is a method of forming an electrically conductive circuit comprising the steps of: preparing a transferring paper in which an assembly of electrically conductive foil carrying a predetermined pattern and an insulating layer containing glass frit and an overcoat layer consisting of a resin film having good burning property are provided on a transferring paper covered with a paste layer; removing an integral structure of the conductive foil, the insulating layer, and the overcoat layer from the transferring paper; transferring the removed integral structure onto a substrate; and burning the substrate with the integral structure set thereon at a temperature where the glass is soften. According to this method, it is possible to eliminate transformation or damage of a conductive foil where a conductive foil is singly disposed on a substrate.
申请公布号 JPS611088(A) 申请公布日期 1986.01.07
申请号 JP19840120648 申请日期 1984.06.14
申请人 MATSUSHITA DENKI SANGYO KK 发明人 NISHINO ATSUSHI;IKEDA MASAKI;WATANABE YOSHIHIRO;HIRAGA MASAHIRO
分类号 H05B3/20;H05K1/03;H05K1/05;H05K3/20;H05K3/28;H05K3/46 主分类号 H05B3/20
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