| 摘要 |
PURPOSE:To improve cooling capability of semiconductor chip in a multichip module by attaining hermetical sealing by closing attaching a metal cap to the rear side of semiconductor chip. CONSTITUTION:A hole 10 for extruded electrode is provided to a semiconductor substrate 1, an extruded electrode 9 is embedded into such extruded electrode hole 10 and input/output terminal of semiconductor chip 2 is electrically connected to an input/output terminal of semiconductor substrste 1, thereby making narrower the distance between the semiconductor substrate 1 and the semiconductor chip 1. A silicon gel 3 is provided in such a gap and a thin film metal cap 4 is closely placed at the rear surface of semiconductor chip 2 in order to attain hermetical sealing. A cooling apparatus 5 is attached to the hermetically sealed portion 4B and the coolant 7 is circulated. Thereby, heat radiation of semiconductor chip 2 can be realized with two systems to heat radiating paths by the extruded electrode 9, silicon gel 3 and thin film metal cap 4 at the rear surface of semiconductor chip 2. Moreover, heat radiation of semiconductor chip 2 can be improved by forced cooling of thin film metal cap 4. |
