| 摘要 |
PURPOSE:To disable the measurement of monitoring elements in chips after cutting and prevent leakage of secrets in manufacturing technique, by a method wherein at least one of pads of monitoring elements is formed on adjacent chip. CONSTITUTION:Transistor Q in a chip 22 has gate electrode pad in an adjacent chip 23, and pads P5, P7 of resistors R1, R2 are in the adjacent chip 23. The transistor Q and resistors R1, R2 can be measured at wafer state, but not after cutting into chips as monitoring elements. Threby manufacturing process technique cannot be known by third parties. |
