发明名称 AUTOMATIC INNER LEAD BONDING METHOD
摘要 PURPOSE:To perform alignment in large magnifacation and high accuracy, by a method wherein alignment mark is spaced from junction position of an inner lead and a fixed ITV detects the deviation of position and corrects it. CONSTITUTION:An alignment mark 13a of an inner lead 13 is made a reference reticle 7a and stored in a processor 8, and distance X1, Y1 from a contact center 14 to the mark 13a is stored in a bonder. When the inner lead 13 comes to the junction positition, XY base 10 is driven and frame 11 is moved. Therefore a supported carrier tape 1 is moved by X1, Y1 and the mark 13a comes to a position (junction position 14) just below a fixed TV camera 6. The reference reticle 7a and the mark 13a in this state are displayed on a monitor 7, and the deviation x, y is detected. The frame 11 is moved by command from the processor 8 and the carrier tape is reversed by X1- x, Y1- y and the deviation is corrected and the junction position of the lead 13 and a die 5 is registered and the junction is effected. In this constitution, magnification of the camera is fully raised and the deviation of position is corrected accurately.
申请公布号 JPS58141(A) 申请公布日期 1983.01.05
申请号 JP19810098710 申请日期 1981.06.25
申请人 SHINKAWA:KK 发明人 NISHIMURA AKIHIRO;CHIBA SEIICHI
分类号 H01L21/60;(IPC1-7):01L21/60 主分类号 H01L21/60
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