| 摘要 |
PURPOSE:To prevent the electrostatic breakdown of a semiconductor element by holding a plastic tape between a brush made of a ferromagnetic body and a magnet and discharging electrostatic charges before the element is bonded to a lead frame on the plastic tape. CONSTITUTION:The lead frames 2 continuously formed to the plastic tape 1 are forwarded along guides 8a, 8b, and the semiconductor elements 5 are regularly pasted onto a substrate 9 at the lower sections of the frames 2. A base 10 is elevated, the electrodes 6 of the elements 5 are brought near to the leads and positioned, a tool 11 is dropped and the elements and the frames are bonded. In the guide 8a, the nose of the brush 13 formed by bundling ferromagnetic metallic fibers 12 is contacted with the surfaces of the tape 1 and the frames 2 and grounded, the metallic fibers 12 are absorbed by means of the magnet 14 buried of the lower section of the brush 13, the nose section is contacted with the tape and the frames at all times, static electricity is removed, and the quantity of the plastic tape 1 electrified after the tape is transferred to the bonding device is brought to approximately zero. Accordingly, the electrostatic breakdown of the elements after bonding can be prevented completely. |
