发明名称 MOLDING METHOD FOR RESIN AND MOLD THEREOF
摘要 PURPOSE:To prevent the formation of voids, pinholes in inside and outside parts of a molded product, by avoiding direct contact of molten resin to the tip part of a lead frame protruding in a cavity for resin molding between upper and lower molds, pressure-injecting it to a bottom face side of said cavity. CONSTITUTION:Step parts 1a, 2a in vertical direction are shaped in a neighboring part of a wall face of a cavity 3 at both molds 1, 2, also a gate 4 provided to the upper mold 1 side is constituted to connect and open at a position so as to be at the almost same level as the bottom face 3a of the cavity at the lower mold 2, and molten resin 7 is pressure-injected from the bottom face 3a side of the cavity corresponding to a lower face side without touching a tip part 6a of a lead frame 6 directly. In such a way, molten resin poured in the cavity does not cause turbulent flow, air entrapping is hindered and formation of voids, pinholes in molded products is prevented.
申请公布号 JPS57210809(A) 申请公布日期 1982.12.24
申请号 JP19810095786 申请日期 1981.06.19
申请人 OSADA MICHIO 发明人 OSADA MICHIO
分类号 H01L21/70;B29B7/00;B29C39/00;B29C39/10;B29C39/24;B29C39/26;B29C45/14;B29C45/26;H01L21/56 主分类号 H01L21/70
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