Electronic device package

摘要

This disclosure relates to an improved apparatus for and method of packaging an electronic device which has at least two electrically operative components which may be printed circuit boards, and a case to space the electrically operative components so that their respective functional surfaces can be positioned in a predetermined relationship, such as to establish a flush surface to allow the application of a single adhesive backed overlay to seal the multiple functional surfaces against entry of foreign matter. The case also serves as a means to gird an elastomeric connecting element which is compressed by the electrically operative components to electrically connect those components.