| 摘要 |
PURPOSE:To provide a thermal head high in the reliability with layers joined together strongly by forming a second electrode conductor at an opening provided at a heat shielding layer while a first electrode conductor is formed on the top surface thereof. CONSTITUTION:A heat shielding layer 2 is formed on an insulating substrate 1 while second electrode conductors 15A and 15B are formed at an opening provided thereon 2. First electrode conductors 13B and 13C are formed on the surface of the second electrode conductors. A flip chip IC 8 as chip part is connected to the insulating substrate 1 through solder joint layers 6A and 6B, the first electrode conductors 13B and 13C and the second electrode conductors 15A and 15B. Heat generated from the chip part is diffused so effectively to better the quality of printing. |
