发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To cut a wire at the flat cross-section without reducing the diameter of the wire by a method wherein a cutter member, having an edge at the lower end and movable by fitting it to the circumference of the tool of a wire bonding device, is provided and the cutter member is moved downward after final bonding has been finished. CONSTITUTION:The bonding tool 11 of a wire bonding device 10 is fixed to the tip of a horn 12, and supersonic waves are oscillated by a supersonic wave generator 13. A wire 15 is fed through a penetrated hole 14. A cylindrical cutter member 16 is fitted to the circumference of the tool 11, and it is shifted in the direction of arrows Z1 and Z2. When a bonding operation is finished, the wire bonding device 10 is shifted to the position clear of an electrode 31 in the direction shown by the arrow X. Subsequently, when magnet valve 20 begins to work, push rods 21 and 22 are pushed out, the cutter member 16 is shifted in the direction shown by the arrow Z2 against a spring 17, and the wire 15 is cut by an edge 16a at the point clear of the second bonding part 34.
申请公布号 JPS6373633(A) 申请公布日期 1988.04.04
申请号 JP19860218321 申请日期 1986.09.17
申请人 FUJITSU LTD 发明人 NAO TAKASHI
分类号 H01L21/60 主分类号 H01L21/60
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