| 摘要 |
A process is disclosed for the adhesive metallization of ceramic materials by roughening of the materials and subsequent chemical and, if necessary, galvanic metal deposition, in which the materials are treated with an alkali hydroxide solution having a temperature from 50 DEG to 180 DEG C. for the roughening, and are subsequently heated to a temperature between about 300 DEG and 600 DEG C. The metal coatings provided on the ceramic materials display adhesive strengths from 3 to 5 kg/inch. Such materials find use in the fields of electrical engineering and electronics. |
