发明名称 INJECTING METHOD OF RESIN FOR SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To prevent the adhesion of resin to an unnecessary section by inclining opposite lead frames and injecting the resin to a clearance section between the lead frames from a nozzle vertically mounted when the clearance is sealed by the resin. CONSTITUTION:The lead frames 1 are placed onto a base 11 while being inclined at a desired angle theta. The nozzles 13, 14 for injecting the resin are vertically arranged to the upper section of the base 11, and vertically moved. The resin is injected as follows. The lead frames 1 are fixed onto the base 11, the nozzles 13, 14 are dropped, and the resin is forwarded by a fixed quantity. The resin flows in from the lateral direction of the opening of the clearance 17 between the opposite lead frames 1 because the lead frames 1 are inclined at that time. When the nozzles 13, 14 are separated after injection, the resin does not intrude to the backs of the lead frames 1 because the resin is forwarded from the vertical direction.</p>
申请公布号 JPS57204137(A) 申请公布日期 1982.12.14
申请号 JP19810089290 申请日期 1981.06.10
申请人 TOKYO SHIBAURA DENKI KK 发明人 NAGAFUCHI TATSUHIKO
分类号 H01L21/56;H01L31/12 主分类号 H01L21/56
代理机构 代理人
主权项
地址