| 摘要 |
A light emitting device comprises a substrate (12); a first chip (14) incorporating a high density of lightemitting diodes (16), e.g. at up to 1000/inch, arranged in a substantially linear array and with electrical contacts (18), preferably extending alternately to opposite sides of the row; and one or a pair of IC chips (24) incorporating RAM and drivers for the diodes. The IC chips (24) are positioned alongside the LED chip (14) and interconnections are made by very fine wires (28) ultrasonically bonded to the contacts (22, 26). The hybrid circuit modules (10, 10a) can be assembled to give an extended diode array. The device (10) is utilised in image transfer systems where the diodes output to fibre optic filaments, micro-lenses or the like closely spaced above the diode chip (14) and having their output at or adjacent to a photosensitive medium. The system is particularly useful for high-speed, high-resolution phototypesetting. |
