| 摘要 |
PURPOSE:To obtain a device having high cooling capability and high reliability by a method wherein the insulating films of semiconductor elements and an internal wall are continuously covered with porous substances under the condition that a cavity is left in an enclosed type package and a refrigerant is impregnated. CONSTITUTION:Most of the surfaces of Si elements 21 are covered with insulating thin films 22 and the rear surfaces of the elements are adhered 24 to an inner surface of a package 23 to leave a cavity 25 and porous substances 26 are continuously adhered to the inner surface and the package 23 is sealed hermetically by filling a refrigerant in the inside. The package 23 is cooled from the other side at the time of operating the elements 21. The elements 21 and package terminals 27 are connected by metallic wires 28. The refrigerant is liquefied to flow into the porous substances 26 and is evaporated after arriving at the upper part of the elements 21 to move A in the cavity 25. Then, the refrigerant is again luquefied at the other end and radiated. Cooling is done through insulating thin films 22 having no gaps only. Therefore, efficiency is good and no insufficient cooling to local calorification occurs. |
