| 摘要 |
PURPOSE:To allow impressing homogeneous pressure on each electrode when bonding for good bump connection, by interposing a resin layer between a flip chip element substrate having bump electrodes and a holding substrate to adhere in a sandwich structure. CONSTITUTION:A resin layer 6 with high heat resistance is interposed between the flip chip element substrate 5 having bump electrodes and holding substrate 7 for thermo compression bonding in the process of forming bump electrodes to adhere the flip chip element substrate 5 and holding substrate 7 on the resin layer 6 to a sandwiching structure. Thus, since the resin layer 6 becomes elastic like a cushion when impressed by pressure, each electrode is evenly impressed in the presence of ununiformity in the height of each electrode or package bending. Then, the reliability of bump connection is improved with less unhomogeneity or reduction of bump connection. |
