发明名称 |
Low thermal resistance insulating support and base or box for power component incorporating such a support |
摘要 |
A low thermal resistance insulating support permitting thermal stresses in the base of a high power component incorporating a beryllium oxide element without fractures or flaws occurring. The support includes a dissipating support made from copper, whose two large faces are slotted to at least partly house a beryllium oxide disk which receives a component and its connections to the outside. Such also completely houses a molybdenum disk with an expansion coefficient close to that of the beryllium oxide.
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申请公布号 |
US4361720(A) |
申请公布日期 |
1982.11.30 |
申请号 |
US19800145023 |
申请日期 |
1980.04.30 |
申请人 |
THOMSON-CSF |
发明人 |
RESNEAU, JEAN-CLAUDE;DOYEN, JEAN;RIBIER, ROBERT |
分类号 |
H05K7/20;C04B37/02;H01L23/15;H01L23/373;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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