发明名称 Low thermal resistance insulating support and base or box for power component incorporating such a support
摘要 A low thermal resistance insulating support permitting thermal stresses in the base of a high power component incorporating a beryllium oxide element without fractures or flaws occurring. The support includes a dissipating support made from copper, whose two large faces are slotted to at least partly house a beryllium oxide disk which receives a component and its connections to the outside. Such also completely houses a molybdenum disk with an expansion coefficient close to that of the beryllium oxide.
申请公布号 US4361720(A) 申请公布日期 1982.11.30
申请号 US19800145023 申请日期 1980.04.30
申请人 THOMSON-CSF 发明人 RESNEAU, JEAN-CLAUDE;DOYEN, JEAN;RIBIER, ROBERT
分类号 H05K7/20;C04B37/02;H01L23/15;H01L23/373;(IPC1-7):H05K7/20 主分类号 H05K7/20
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