| 摘要 |
PURPOSE:To obtain the highly reliable semiconductor device of solidly-built structure having sufficient sealing width by a method wherein the base of an axial type package is used as a flat base, and a cap is sealed on the above using a low melting point glass. CONSTITUTION:In the case of the semiconductor device consisting of the axial type package, the base 10 of the package is formed into a flat base having the flat-plate structure of ceramic material. A pin 12 to be used for a lead is provided on the lower surface of the base 10, and a pellet 4, which is a semiconductor chip, a wire 16 to be connected to the pellet 14, and a cap 18 to be used to seal the pellet 14 are provided on the lower surface of the base 10. A concaved part 20, having enough space to seal the pellet 14, is provided on the inside of the center part of the cap 18, and its outer circumferential side is used as a sealing section 22. Then, the lower surface of the sealing section 22 of the cap 18 is sealed on the base 10 using low melting point glass 24. |
