| 摘要 |
PURPOSE:To avoid the inconvenience of radiator to be removed from the substrate when the cap is taken away making the mounted semiconductor device radiate efficiently by a method wherein the ceramic substrate itself is constituted to be provided with the radiating elements. CONSTITUTION:The multiple elements 12 are mounted on the surface of the ceramic (e.g. silicon carbide) substrate 11 and said elements 12 are connected to the conductors on said substrate 11 while the metallic cap 13 is fixed on the surface of said substrate 11 by means of soldering to seal each element 12 airtightly. On the other hand, the convex and concave fins 14 are formed on the backside of the ceramic substrate 11 i.e. on the radiating surface. The heat radiated from the operating semiconductor elements 12 thickly mounted may be efficiently cooled down by means of said fins 14. |
