| 摘要 |
An array of electronic packaging substrates in horizontal and vertical rows in which each substrate has a plurality of internal and external terminals that are electrically interconnected is described. The array has (a) lines of separation along which the substrates may be separated from the array, (b) a plurality of adjacent rows of substrates with lines of separation therebetween that are spaced and parallel, and (c) at least a pair of metallized traces at least one of which runs between the spaced lines of separation, each of which is electrically connected to at least one external terminal in the adjacent rows of substrates and to a contact pad on the array. Selected terminals of substrates in the array are thus electrically connected to a contact pad whereby, after attachment of electronic components to the substrates, the components may be tested in an array format. |
