| 摘要 |
PURPOSE:To shorten the time of bonding by mounting a magazine encasing a plurality of lead frames while upward directing a bonding surface, a magazine guide means and a bonding positioning means. CONSTITUTION:The bonding device consists of the magazine 2 encasing a plurality of lead frames, the magazine guide 5 and the positioning pin 6. The magazine 2 encasing the lead frames 1A-1H is guided by means of the magazine guide 5, the positioning pin is moved in the arrow B direction and inserted into a hole 2a when the first lead reaches the position of bonding, and the magazine 2 is positioned. A heat block 7 is contacted with the frame 1A, and a bonding section is heated. A detector is moved in the XY directions, and the position of bonding is detected. The detecting signals drive a bonding arm 10, and bonding is conducted. |
