| 摘要 |
<p>PURPOSE:To readily and exactly remove a semiconductor wafer from a table by dicing the wafer upon vacuum attracting of the wafer on the table and then supplying liquid for floating the wafer between the table and the wafer at the bonded surfaces therebetween. CONSTITUTION:A semiconductor wafer 12 is placed on a position corresponding to the attracting portion 2 on a table 1, and a control valve 5 is operated to communicate the intake passage 4 with a vacuum pump 6 to retain the wafer on the table 1. Then, a lattice cutting grooves are formed on the wafer 12 by the blade 12 while injecting the liquid for cooling and cutting the wafer 12 from a nozzle 11. Then, the valve 5 is again operated to communicate the passage 4 with a liquid supply pump 7 to supply the water L to the passage 4 to flow the water to the bonded surfaces of the wafer 12 and the table 1 so as to float the wafer 12 on the surface of the table 1. Thus, the adhering strength of the wafer 12 on the table 1 is weakened to readily remove the wafer 1 from the table 1.</p> |
