发明名称 VERPACKUNGSEINHEIT, VERFAHREN ZU IHRER HERSTELLUNG UND VORRICHTUNG ZUR DURCHFUEHRUNG DIESES VERFAHRENS
摘要 The package is obtained by arranging a plastic film (8) on a corrugated board frame (4) having only vertical walls, by bringing the film at a temperature exceeding the softening temperature, by pressure application and suction of the film in a die (48) partially in the frame. The film is partially welded above the die to the inner wall of the frame, whereas the remainder of the film is conformed to the die by cooling. The upper tool (50) has punches (68) to the contact of which the film is immediatly cooled while keeping its original wall thickness. The corrugated board frame (4) may comprise recesses in the upper and lower edges to receive, without any solution of continuity, the superposed packages during the crossed piling.
申请公布号 DE3117736(A1) 申请公布日期 1982.11.18
申请号 DE19813117736 申请日期 1981.05.05
申请人 KOCHANEK,EBERHARD 发明人 KOCHANEK,EBERHARD
分类号 B31B7/00;B31B7/74;B65D5/00;B65D5/36;B65D5/56;B65D6/00;B65D21/02;B65D81/07 主分类号 B31B7/00
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