| 摘要 |
<p>PURPOSE:To insulate a device electrically, and to transmit only heat to a cooling piece by positioning a sintered body, the principal ingredient thereof is SiC and which contains at least one kind of BeO or BN, between a semiconductor element and the cooling piece. CONSTITUTION:An electrical insulating material 3 is disposed between the semiconductor element 1 and the cooling piece 2. The insulating material 3 is the sintered body obtained by adding BeO or BN to SiC, its resistivity is 10<10>OMEGAcm or higher, and its thermal conductivity is 0.7cal/cm.S. deg.C and is higher and Al, and its mechanical strength is also high. Accordingly, the device has no electrical effect, only heat from the semiconductor element is transmitted, dielectric breakdown is not generated, and the cooling device having high reliability is obtained.</p> |
