发明名称 SUBSTRATE-SPINNING APPARATUS
摘要 PROBLEM TO BE SOLVED: To avoid defectiveness in treatment caused by rotating a substrate to be subjected to the treatment, regarding cleaning by fixed posture, to improve the yield of products, and at the same time, to appropriately cope with a plurality of kinds of treatment. SOLUTION: In the substrate-spinning apparatus 57, having a chucking mechanism 59 interlocked to a rotating substrate 83, that is rotated by the operation of a rotary driving mechanism 60, while the chucking mechanism can be rotated with the rotary substrate 83, a tilt mechanism 62 is provided, where the tilting mechanism tilts a substrate 2, gripped by the chuck mechanism 59. In the tilting mechanism 62, a mounting member 81 for rotatably supporting the rotating substrate 83 is supported to a substrate-side member 105, while the mounting member can be freely tilted. Also, the rotary driving mechanism 60 is fitted to the mounting member 81, while the chucking mechanism 59 grips the substrate 2 in a vertical posture.
申请公布号 JP2002164317(A) 申请公布日期 2002.06.07
申请号 JP20000359709 申请日期 2000.11.27
申请人 ISHII HYOKI CORP 发明人 NAKANO TERUYUKI
分类号 B08B1/04;B08B3/02;B08B7/04;H01L21/304;(IPC1-7):H01L21/304 主分类号 B08B1/04
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