| 摘要 |
<p>Composition, apparatus and process for directing a narrow spray (84) of a rapid drying polymer solution to form in situ a web fabric structure (50, 150) to hold closely spaced discrete electrical components and integrated circuits (30) in place on a printed circuit board (40) with the external leads of connectors of such units (71-76) projecting through holes in such circuit board so that such units are held to the circuit board during soldering of those leads to the conductive portions of the printed circuit board and other manipulations. The fabric structure is of a chemical composition that may be readily completely removed, such as by solvent action, from the circuit board and from the units after need for such fabric has passed. A solder masking agent, also disclosed, can be removed at the same time the web fabric structure is removed. A useful fabric forming spray solution is acrylic resin in an alcohol solution.</p> |
