| 摘要 |
A solder composition for bonding a semiconductor die to a plated or unplated metal package member. In one embodiment the solder composition comprises, in weight percent, 5-8 copper, 20-40 silver, and the balance tin. Such a composition is particularly efficacious for bonding to copper and copper alloy package members. A further embodiment particularly efficacious for bonding to nickel and nickel alloy members further comprises the addition of 0.5-3.0 weight percent selenium.
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