| 摘要 |
PURPOSE:To prevent a fine Al wire from contacting with a molding material directly and being corroded, by forming an oxie film on an Al surface of a bonding pad, after connecting the fine Al wire to the bonding pad. CONSTITUTION:A diffusion layer 2, an SiO2 film 3, an Al pattern 4 and a protection film 5 are formed on a main surface of an Si substrate 1. The protection film 5 on a bonding pad 6 is removed. The element is connected to an IC header 7. A fine Al wire 8 connects the bonding pad 6 and an IC lead 9. The whole element is sealed by a molding material 10. In this case, after the connection of the fine wire, an Al oxide film 11 of 1,000-2,000Angstrom is formed on the surface of the bonding pad 6, and fine Al wire 8. |
