| 摘要 |
<p>PURPOSE:To prevent a shortcircuit accident or a decrease in the withstand voltage and in a current capacity at an overhang part of a semiconductor device by softening and suspending the overhang part of an adhesive by heating and covering the periphery of an electrode metal layer. CONSTITUTION:Overhanging parts 75a, 76a are respectively formed at electrode metal layers 75, 76 in the state where the process strain layer of the peripheral surface 77 of a pellet 7 is removed, are etched to completely remove the overhanging part 76a. The etching is temporarily stopped in this state, the entirety is heated to soften and sag down the overhanging part 11a of the adhesive 11, the periphery of the layer 76 is completely covered with the adhesive 11, the layer 75 is additionally etched to completely remove the part 75a, only the adhesive 11 is dissolved to exfoliate and remove a masking member 12, and an adhesive 9 is further dissolved, and pellets 7 are exfoliated from a support 10.</p> |
