发明名称 THERMOSETTING RESIN COMPOSITION
摘要 A thermosetting resin composition is provided to realize improved crosslinking density, mechanical properties and heat resistance, and to cause no yellowing even at high temperature. A thermosetting resin composition comprises a copolymer(A) of (a1) an unsaturated carboxylic acid or anhydride thereof; (a2) an epoxy group-containing unsaturated compound; (a3) a trialkoxysilane-based unsaturated compound; and (a4) an olefinic unsaturated compound. The copolymer(A) comprises repeating units derived from the trialkoxysilane-based unsaturated compound in an amount of 5-60 wt%.
申请公布号 KR20080067425(A) 申请公布日期 2008.07.21
申请号 KR20070004684 申请日期 2007.01.16
申请人 KOLON INDUSTRIES, INC. 发明人 LEE, KYE WON;YOON, KYOUNG KEUN;KIM, JIN HWAN;LEE, DONG HEE;PARK, JONG MIN
分类号 C08L23/00;C08L101/00 主分类号 C08L23/00
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