Process for producing lines of weakness in the protective backing of an adhesive laminate

摘要

A process and apparatus for forming a line of weakness in the protective backing of an adhesive laminate is disclosed. The process is performed by generating a laser beam of sufficient energy to vaporize at least a portion of the protective backing of an adhesive laminate. The laser beam is focused in a focal line extending across the protective backing for a time sufficient for vaporizing at least a portion of the protective backing. At least a portion of the protective backing is vaporized with the laser beam to a depth sufficient for forming a line of weakness in the protective backing along the focal line.