| 摘要 |
PURPOSE:To simplify a mounting step by opening holes at a circuit substrate at both side of an IC chip when the chip secured onto the substrate is sealed with resin, inserting pin-shaped projections formed on a sealing frame and filling the resin while surrounding the chip with the frame. CONSTITUTION:An IC chip 3 is secured onto a circuit substrate 1 formed with a circuit pattern 2, and an electrode formed on the chip 3 is connected with a lead wire 4 to the pattern 2. In order to then seal the chip 3 including the lead wire 4 with the resin, through holes 10 are opened at the substrate 1 at both sides of the lead wire 4. On the other hand, to improve the resin sealing, a sealing frame 15 of a resin-molded article having more than two pin-shaped projections 20 is prepared at the lower portion the projections 20 are inserted into the holes 10, and the chip 3 is surrounded by the frame 15. In this manner, the resin 16 is flowed and solidified in the frame 15. Thus, the sealing can be performed on meet the necessary size, and is adapted for a camera or the like. |
