| 摘要 |
A semiconductor chip carrier having a lead frame wherein the ends of each of the inner lead portions, which are closely adjacent to the semiconductor device to which the leads are to be bonded, are manufactured with the inner leads temporarily connected to a common supporting rim which must be removed after the attachment of the lead frame to the ceramic substrate is completed. This provides accurate and constant spacing between the leads of the lead frame during the bonding of the lead frame to the ceramic substrate. The rim is removed from the lead frame after bonding of the lead frame to the ceramic substrate. This is accomplished by reducing the thickness of the rim and a portion of the leads of the lead frame contacting and closely adjacent to the rim. This provides a space between the rim and the substrate during the bonding of the lead frame to the substrate. In this way, the rim and a small portion of the leads do not bond to the substrate, thereby allowing the rim to be later removed quite easily. |
