| 摘要 |
PURPOSE:To improve the wetting property and the bondability of a soldering material by a method wherein punching pattern is changed in such a manner that one of tab lifting sections is punched out so that it is linked with the outer lead extending in the direction different from that opposing to the other tab suspending section, thereby allowing to reduce the deformation of the tab lifting section. CONSTITUTION:A tab 11 is formed in such a manner that it will be positioned a little lower than the plane surface of the tab lifting sections 12 and 13. The tab lifting sections are to be punched out in such a manner that one tab lifting section 12 will be linked to a coupled part 10A, and the other tab lifting section 13 will be linked to an outer lead section 19 respectively. Accordingly, the deformation of the tab lifting section in the direction of the arrow A can be prevented effectively because the internal stress of the tab lifting sections 12 and 13 is reduced. The suppression of the deformation in the direction A of the tab lifting sections 12 and 13 allows the tab 11 to maintain an appropriate plane position, and the workability can be greatly improved when pellet attaching and wire bonding works are performed. |
