| 摘要 |
PURPOSE:To enable to lead out the lead wire to the outside from the circuit part hermetically sealed in a package which is airtightly maintained by a method wherein a thin metal film is formed on the inner and outer surfaces of a polymer film, and at the same time, a junction type conductive material is provided. CONSTITUTION:The thin metal film 9 is formed on both inner and outer surfaces opposing each other at the connected position of the external wiring of the polymer film 7 on the package 8 wherein the circuit part 6 was hermetically sealed. On the thin film 9, a junction type conductive material such as a rivet 10 and the like is driven into in such a manner that the polymer film 7 is penetrated. Then, the rivet 10 and the thin film 9 are joined together gaplessly using solder 11 of low melting point, and at the same time, the part 6 in the package 8 and the rivet 10 are connected using a lead wire 12. As a result, the external wiring can be easily formed by soldering the lead wire for external wiring to the rivet 10, and the adhesive state at the junction part of the rivet 10 can be excellently maintained by the soldering performed on the rivet 10 and the thin film 9. |
