发明名称 EMBALLAGE POUR COMPOSANTS ELECTRONIQUES
摘要 <p>The packing material consists of a strip (3) with holes (5) for components at regular intervals along its length. It also has two series of transporter holes (7) along the edge of the strip. The transporter holes are at the same intervals as the component holes. The underside of the strip is partially covered by a strip of adhesive tape (9), which closes off the bottoms of the component holes. The tape is punctured by small holes (13), which occur at the centre of each component hole, to allow the component to be pushed out of the package from underneath. The strip may be made from a variety of different materials, e.g. paper, plastic, cardboard, etc. It may be slightly flexible so that a long strip may be stored in a spiral roll. It is particularly suitable for flat or block-shaped components, without long connecting wires, such as integrated circuits.</p>
申请公布号 FR2503673(A1) 申请公布日期 1982.10.15
申请号 FR19810007061 申请日期 1981.04.08
申请人 PHILIPS GLOEILAMPENFABRIEKEN NV 发明人 GODWIN J.O.G. VAN HOOREWEDER ET LOUIS VICTOR CLAESKENS;CLAESKENS LOUIS VICTOR
分类号 B65D73/02;H05K13/00;(IPC1-7):65D73/02;05K13/00 主分类号 B65D73/02
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