| 摘要 |
PURPOSE:To catch an inspecting position automatically in the visual field of a high-magnification lens by positioning the wafer according to the information of the inspecting position and inspecting the surface of the wafer by means of the high-magnification lens according to information detected by means of a low- magnification lens. CONSTITUTION:A base plate 6, on which the semiconductor wafer 1 is placed and which can be moved in the triaxial direction, is brought into the visual field of the low magnification lens system of the expanding section 12 of a pickup device 9a according to the information of the inspecting position previously determined. The pattern of the surface of the semiconductor wafer 1 is converted into electrical signals by a pickup section 13. The electrical signals from the pickup section 13 are displayed to a Braun tube 10 while being transmitted to a calculator 14, and the inspecting position is detected through the recognition of the pattern. The calculator 14 drives the base plate 6 by means of a driving device 18 so that the inspecting position is brought into the visual field of the high-magnification lens by information detected. The expanding section 12 is changed over to the high-magnification lens. |
