发明名称 HEAT SINKS FOR SEMICONDUCTOR ARRANGEMENTS
摘要 <p>A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of high thermal conductivity. A single unit including the heat sink with a plurality of diodes is used as a bridge rectifier in single phase or polyphase circuits.</p>
申请公布号 GB2014360(B) 申请公布日期 1982.10.06
申请号 GB19780048048 申请日期 1978.12.12
申请人 BOSCH GMBH R 发明人
分类号 H01L23/42;H01L23/049;H01L23/28;H01L23/31;H01L23/34;H01L23/373;H01L23/492;H01L25/07;H02M7/00;(IPC1-7):01L23/36 主分类号 H01L23/42
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