| 发明名称 |
Fabrication of circuit packages |
| 摘要 |
A method of fabricating circuit packages which employ macro-components (10) mounted on supporting substrates (20). In order to maintain sufficient clearance between the component and substrate and achieve high reliability bonds, massive solder preforms (16) are applied to contact pads on either the component or substrate. After contact pads of both carrier and substrate are brought into contact with the spheres, the bond is formed.
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| 申请公布号 |
US4352449(A) |
申请公布日期 |
1982.10.05 |
| 申请号 |
US19790107327 |
申请日期 |
1979.12.26 |
| 申请人 |
BELL TELEPHONE LABORATORIES, INCORPORATED |
发明人 |
HALL, PETER M.;HOWLAND, FRANK L.;MORABITO, JOSEPH M.;RICKABAUGH, LAWRENCE J. |
| 分类号 |
H01L23/12;H01L21/58;H01L23/32;H01L23/498;H05K3/34;(IPC1-7):B23K1/02;H01L21/60 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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