| 摘要 |
<p>PURPOSE:To provide the titled compsn. suitable for use in bonding heat-curable rubber to various adherends, by blending an organosilicon compd. having at least two alkoxy groups, a hydroperoxide and an org. solvent. CONSTITUTION:100pts.wt. organosilicon compd. having at least two alkoxy groups attached to a silicon atom per molecule and of the formula[wherein R<1> is (halo)alkyl, aryl; R<2> is a monovalent hydrocarbon group having at least one group selected from alkenyl, vinylcarbonyloxy, amino, epoxy and mercapto groups; R<3> is alkyl; a, b are each 0-3, c is 2-4 with the proviso that a+b+c= 2-4]such as vinyltrimethoxysilane, 0.5-50pts.wt. hydroperoxide such as 2,4,4- trimethylpentyl-2-hydroperoxide and an appropriate amount of an org. solvent such as toluene or trichloroethylene are blended together.</p> |
