发明名称 |
Liquid-cooled electric subassembly, and method for producing it |
摘要 |
In subassemblies having components through which electric current flows, there is the problem of dissipating heat in a pinpointed and highly efficient manner. For this purpose, a cooling element (7) is fitted with a spiral coolant line (20-24), which is located as near as possible to at least one surface (25, 26). The spiral shape of the coolant line (20-24) is particularly suitable, since in most active semiconductor elements heat is to be dissipated by a circular surface. A method for producing cooling elements is suitable, in particular for mass production on a pressure die-casting machine. In this process, the coolant line is positioned during the actual casting process by means of supports (15) and a controllable core (16a). <IMAGE>
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申请公布号 |
DE3114556(A1) |
申请公布日期 |
1982.09.30 |
申请号 |
DE19813114556 |
申请日期 |
1981.04.10 |
申请人 |
INJECTA AG |
发明人 |
BERIGER,CONRAD,DIPL.-ING.;BERTHOLD,GUENTER;SPITTALER,GUENTHER |
分类号 |
H01L23/473;H05K7/20;(IPC1-7):28D7/04;01L23/46;05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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