发明名称 CHIP PART
摘要 PURPOSE:To mount a core easily to a printed substrate by sintering a mixture of magnetic substance powder and resin onto an outer circumferential surface except the terminal sections at both ends of a cylindrical conductor. CONSTITUTION:The pasty material obtained by mixing the magnetic substance powder of ferrite, etc. and a binder such as acrylic resin is applied onto the outer circumferential surface of the cylindrical conductor 14 while leaving the both ends as the terminal sections 14a, 14b, and sintered, and the core 15 is formed. The surfaces of the terminal sections 14a, 14b are plated with solder as necessary. The chip part 13 shaped in this manner is mounted at the predetermined position of the printed substrate together with other chip parts, such as a capacitor, a resistor, a transistor, etc., and the printed substrate is passed in a melted solder tank. Accordingly, the surface of the printed substrate can be soldered.
申请公布号 JPS57154809(A) 申请公布日期 1982.09.24
申请号 JP19810040769 申请日期 1981.03.20
申请人 ALPS DENKI KK 发明人 IJICHI SADAYOSHI;NISHIZAWA EIJI
分类号 H05K1/18;H01F17/04;H01F17/06;H01F27/00 主分类号 H05K1/18
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