发明名称 |
RAISED CONTACT PORTIONS OF ELECTRONIC MICROCIRCUIT |
摘要 |
A method of providing a raised contact portion on a contact area of an electronic microcircuit in which a ball is formed at one end of a metal wire by means of thermal energy, the ball is pressed against a contact area of the electronic microcircuit and is connected to said contact area. A weakening is created in the wire near the ball and the wire is then severed at the area of the weakening to provide the desired raised contact portion. |
申请公布号 |
AU8160382(A) |
申请公布日期 |
1982.09.23 |
申请号 |
AU19820081603 |
申请日期 |
1982.03.17 |
申请人 |
PHILIPS: GLOEILAMPENFABRIEKEN, N.V. |
发明人 |
HERMANUS ANTONIUS VAN DE PAS;HUIBERT ARNOLDUS KNOBBOUT |
分类号 |
H01H11/06;H01L21/28;H01L21/60;H01L21/603;H01L21/607;H01L23/485;H05K3/24 |
主分类号 |
H01H11/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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