发明名称 INJECTION BONDING METHOD
摘要 PURPOSE:To bond members having relatively large bond areas or complicated structures within a short period without using heating facilities or the like, by defining a space between the members into which an adhesive will be introduced, and setting them followed by introduction of a fast-setting adhesive. CONSTITUTION:For instance, a reinforcing member 2 is set in position on the panel 1, and the fast-setting adhesive is introduced into the space 3 defined between them from an introducing port 4, and is set to bond them. For instance, the reinforcing member is formed with the space 4 such that the adhesive will be introduce in a required thickness, and the introducing port 4 is previously formed in position.
申请公布号 JPS57152917(A) 申请公布日期 1982.09.21
申请号 JP19810039217 申请日期 1981.03.18
申请人 NIPPON KENTETSU KK 发明人 KABURAGI TAKAHIKO
分类号 B29C55/00;B29C37/00;B29C65/00;B29C65/52;B29C65/54;B29C65/78;C09J5/00 主分类号 B29C55/00
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