| 摘要 |
PURPOSE:To obtain a wire bonding method enabled to shorten the sending time of a lead frame and to perform high precise bonding by a method wherein detection of the amount of plural devices and wire bonding are performed at the same time, and moreover the lead frame is sent by the distance corresponding to the amount of the plural devices. CONSTITUTION:When bonding is to be performed making the ten devices as a unit, for example, wire bonding is repeated detecting the devices one after another, and when wire bonding of the ten devices is completed, the lead frame 1 is sent in the direction A by the distance corresponding thereto. At the same time, a bonding head 13 is made to transfer in the direction A by the distance corresponding to the ten devices, and is positioned at the starting position. Then detection and wire bonding of the device from the eleventh up to the twentieth are performed. This operation is repeated in order thereafter. Accordingly shortening of sending time can be attained, discrepancy of position of the lead frame is not generated, and enhancement of precision can be also attained. |
