| 摘要 |
<p>PURPOSE:To achieve the stablized titled device economically without need of enlarging a chip area of integrated circuits by providing a pattern for matching use in a bonding pad part formed on a main plane of a semiconductor chip. CONSTITUTION:A mark 1 for matching of recesses or metal surfaces in a bonding pad 2 or its adjacent area is placed. For this, first, a resist 6 is coated on a silicon oxide film 12 in the surface of a silicon wafter 5, the pattern is exposed and developed with the aid of a mask, and a part thereof 7 is etched to form a recess hole 8 for matching use. Next, a aluminium 10 for wiring is vaporized onto a wafer surface 9, and a resist is coated and exposed. With this process, detection of reflected electrons or secondary electrons due to electron beams can be easily made because the vicinity of the bonding pad is extremely flat, so that wiring work can be carried out precisely.</p> |
