| 摘要 |
A method and device for producing multilayer printed circuit boards, under the application of heat and pressure to a stack of printed circuit boards and interposed layers of thermosetting plastic, the multilayer stack being heated in a first press to a curing temperature above the flux point of the bonding layers, then precooled under continued pressure to a transfer temperature below the flux point and transferred to a second press, where it is aftercooled under pressure to ambient temperature. The press installation of the invention includes two independently operating multi-stage presses in a common press frame. The plates of the press stages are horizontally aligned in the open position of the two presses. |
