| 摘要 |
PURPOSE:To improve the inspecting accuracy of an automatic inspecting device by automatically recognizing the pad position of a semiconductor chip and positioning it at the probing terminal. CONSTITUTION:A Y-axis table 2 is provided on an X-axis table 1, and a theta- axis table 3 and a Z-axis table 4 are provided on the table 2. A tray 6 containig a semiconductor chip 7 secures a chip 7 with a vacuum chamber chuck 5. The position of the chip 7 in the tray 6 is detected by a camera 8. After the displacement of the chip 7 is calculated according to the positions of the chip and the position of a probe 9, the tables 1, 2 are driven to move the chips 7 to a probing unit and are positioned with the probe pin 11. |
