| 摘要 |
PURPOSE:To position the electrode of an IC, the lead of a film carrier and the lead of a stem, on which the IC is placed, automatically, and to connect them by mounting a guide pin to the stem and placing the film carrier through an insulating film. CONSTITUTION:Guide leads 3, an electrode terminal group 4 and a semiconductor element fixing section 5 are formed to the upper surface of the stem 1 with the leads 2. A polyimide sheet 6 in which hole sections 7, 8, 10 are shaped to sections corresponding to stem electrodes, the guide leads and the element fixing section is inserted and placed to the stem by using the guide leads 3. The film carrier 11 with guide holes 12, holes 13 for connection, the leads 14 and elements 15 is inserted and placed onto the sheet 6, and connected through thermocompression bonding. Accordingly, the stem electrodes and the leads automatically corresponding can be positioned and connected, and the semiconductor device with a large number of pins having small conduction resistance can be mounted. |
