| 发明名称 |
Sputtering apparatus. |
| 摘要 |
<p>A sputtering apparatus has a cathode (12) and a substrate electrode (13). Material from a target (16) is sputtered to form a thin film on a substrate (15) on an electrode surface plate (14) of the substrate electrode. To increase the uniformity of the thickness distribution of the film deposited, the electrode surface plate (14) is made of a soft magnetic material. </p> |
| 申请公布号 |
EP0058560(A2) |
申请公布日期 |
1982.08.25 |
| 申请号 |
EP19820300772 |
申请日期 |
1982.02.16 |
| 申请人 |
HITACHI, LTD. |
发明人 |
HOMMA, YOSHIO;TSUNEKAWA, SUKEYOSHI;MORISAKI, HIROSHI;HARADA, SEIKI |
| 分类号 |
C23C14/34;C23C14/35;C23C14/36;H01J37/34;(IPC1-7):01J37/34;23C15/00 |
主分类号 |
C23C14/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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